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      • AKRMV Automotive varistors
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      • PTC-For Overheat Sensing
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      • Multilayer Chip HighFrequency Inductor
      • Multilayer Chip Power Inductor
      • Wire Wound SMD PowerInductors(Unibody)
      • Wire Wound SMD PowerInductors(Magnetic Shielded)
      • Wire Wound SMD PowerInductors(Open Magnetic)
    • A list of historical models
      • KRVA series Varistors
      • KRVB series Varistors
      • KRVD series Varistors
      • KRVV series Varistors
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      • PTC-P series thermistors
      • PTC-S series thermistors
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  • Home
  • About us
    • About us
    • Company Culture
  • Products
    • GRACE automotive electronics series
      • AKRMV Automotive varistors
      • AKNTC Automotive NTC thermistors
    • NTC Thermistor
      • NTC-Thermometry Sensing
      • PTC-For Over Current Protection
      • PTC-For Overheat Sensing
    • Chip Varistors
      • For ESD Protection
      • For Surge Protection
    • ESD Suppressors
    • Chip Ferrite Beads
      • For Signal Lines
      • For Audio Lines
      • For Power Lines
    • Inductors
      • Multilayer Chip HighFrequency Inductor
      • Multilayer Chip Power Inductor
      • Wire Wound SMD PowerInductors(Unibody)
      • Wire Wound SMD PowerInductors(Magnetic Shielded)
      • Wire Wound SMD PowerInductors(Open Magnetic)
    • A list of historical models
      • KRVA series Varistors
      • KRVB series Varistors
      • KRVD series Varistors
      • KRVV series Varistors
      • NTC Thermistor
      • PTC-P series thermistors
      • PTC-S series thermistors
  • Support
    • Technical Articles
    • Application Guide
      • Auto
      • Electronics
      • Communication Equipment
      • Device
      • Medical Equipment
      • Industrial Equipment/New Energy
    • Technical Program
    • FAQ
      • All Questions
      • Chip Varistors
      • NTC Thermistor
      • ESD Suppressors
      • Chip Ferrite Beads
      • Inductors
      • Other
    • Sample Request
  • News
    • Company News
    • Industry Trends
  • Contact Us
  • Join us

News

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See allCompany NewsIndustry Trends
Jun42025

低温烧结银胶技术迎来突破性进展,半导体封装开启新纪元

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国内首个TGV技术产业联盟在东莞松山湖揭牌,引领先进封装技术革新

Industry Trends2025-06-03

国内首个TGV产业联盟正式成立 2025年5月23日,国内首个聚焦玻璃通孔(Through Glass Via,TGV)技术的产业联盟在东莞…

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中美日内瓦经贸会谈联合声明:加征关税保留10%

Industry Trends2025-05-27

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Mar112025

台积电董事长魏哲家宣布在美新增1000亿美元投资:重塑全球半导体格局

Industry Trends2025-03-11

一、投资背景与动因 2025年3月4日,全球领先的半导体制造商台积电(TSMC)宣布,计划在美国工厂追加1000亿美元的投资,以大幅提升其在…

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Mar32025

新型电池产业规模持续扩张:技术创新与市场重构下的全球竞合新格局

Industry Trends2025-03-03

一、市场规模:全球需求驱动下的爆发式增长 2024年,中国新型电池产业规模突破历史新高,锂离子电池产量达203.6亿只,同比增长12.3%,…

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Products
  • NTC Thermistor
  • Chip Varistors
  • ESD Suppressors
  • Chip Ferrite Beads
  • Inductors
Support
  • Support
  • Technical Articles
  • Application Guide
  • Technical Program
  • Sample Request
About us
  • About us
  • Company Culture
  • News
  • Contact Us

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